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AIDA
GELINA
BRIKEN
nToF
CRIB
ISOLDE
CIRCE
nTOFCapture
DESPEC
DTAS
EDI_PSA
179Ta
CARME
StellarModelling
DCF
K40
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DESPEC |
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Message ID: 698
Entry time: Wed Feb 12 10:46:01 2025
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Author: |
TD |
Subject: |
Offline analysis data files S181 R4_351-396 |
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Analysis data files R4_351-396
Data file R4_351 first WR ts 0x17D7B4C72B0BA9C8
Converting hexadecimal timestamp to decimal: 1718040550378809900
Assuming that this timestamp is in nanoseconds (1 billionth of a second):
GMT: Monday, June 10, 2024 5:29:10.378 PM
Your time zone: Monday, June 10, 2024 6:29:10.378 PM GMT+01:00 DST
Relative: 8 months ago
Data file R4_396 first WR ts 0x17D7BE86408888E8
Converting hexadecimal timestamp to decimal: 1718051266682718500
Assuming that this timestamp is in nanoseconds (1 billionth of a second):
GMT: Monday, June 10, 2024 8:27:46.682 PM
Your time zone: Monday, June 10, 2024 9:27:46.682 PM GMT+01:00 DST
Relative: 8 months ago
Attachments 1-2 - analysis data files R4_351 and R4_396
max. *time averaged* deadtime FEE64 #7 (aida08) 1.7% and 1.7% respectively
all other FEE64 deadtimes < 1%
FEE64 configuration
FEE64 a b c
g h
d e f
a b c d e f g h
DSSSD#1 15 3 12 9 1 5 2 4
DSSSD#2 11 7 16 10 14 13 6 8
n+n Ohmic FEE64s 2, 4, 6, 8
Data analysis assumes
- all LEC ADC data channels with valid ADC offset included (1012 of 1024 channels)
LEC calibration ADC offset only
- no clustering
- no multiplex timestamp correction
- no p+n junction side - n+n Ohmic side correlation time gates
- FEE64 *not* DSSSD strip ordering
- hardware - slow comparator setting p+n junction FEE64s 100keV, n+n Ohmic FEE64s 150keV
- LEC energy difference +/- 11200keV (wide open for first pass analysis)
- HEC energy difference +/- 1.68GeV
- valid LEC events
p+n junction side multiplicity = 1 and n+n Ohmic side multiplicity = 1
LEC energy > 151keV
to select candidate beta and alpha events - will include light ions
standalone analysis of AIDA data, no downstream veto detector
- valid HEC events
p+n junction side multiplicity > 0 and n+n Ohmic side multiplicity > 0
(x,y) strips corresponding to maximum energy
p+n junction and n+n Ohmic side HEC
- HEC veto
p+n junction side multiplicity > 0 or n+n Ohmic side multiplicity > 0
- per pixel implant-decay correlations
- end of event
difference in WR timestamp between successive ADC data items > 2500 and overall event length < 33us
Number of events observed
*** scaler # 1 count: 35941696 DSSSD#1 decay events LEC m_p = 1 and LEC m_n = 1, ADC data > 151.2keV *and* HEC m_p = HEC m_n = 0, ADC data > 151.2MeV
*** scaler # 2 count: 31960753 DSSSD#2 decay events LEC m_p = 1 and LEC m_n = 1, ADC data > 151.2keV *and* HEC m_p = HEC m_n = 0, ADC data > 151.2MeV
*** scaler # 3 count: 1499844 DSSSD#1 implant events HEC m_p > 0 and HEC m_n > 0, ADC data > 151.2MeV
*** scaler # 4 count: 1297356 DSSSD#2 implant events HEC m_p > 0 and HEC m_n > 0, ADC data > 151.2MeV
*** scaler # 5 count: 5446969 DSSSD#1 other events HEC m_p > 0 or HEC m_n > 0 *and* LEC m_p > 8 or LEC m_n > 8
*** scaler # 6 count: 75030747 DSSSD#2 other events HEC m_p > 0 or HEC m_n > 0 *and* LEC m_p > 8 or LEC m_n > 8
DSSSD#1 implant events
x=m_p=0 ?
y=m_n=0 ?
DSSSD#2 implant events
x=m_p=0 ?
y=m_n=0 ?
Attachments 3-6 - per FEE64 LEC data item rates 268ms/channel - common x and y scales
- no conditions
- 150keV < energy < 1500keV
- energy > 1500keV
Some deadtime observed on spill, none observed off spill. No significant variation in per FEE64 LEC data rates.
Attachments 7-8 - per FEE64 LEC hit patterns
- 150keV < energy < 1500keV
- energy > 1500keV
Aside from usual hot channels at cable/DSSSD boundaries good hit pattern observed. For > 1500keV events observe flat field in x-plane, focussed in y-plane.
Attachments 9-11 - per FEE64 HEC data item rates 268ms/channel - common x and y scales
- no conditions
- 100MeV < energy < 1000MeV
- energy > 1000MeV
Note hot HEC channel in aida08 - should be disabled.
Attachment 12 - per DSSSD decay and implant rates 262us/channel - common x and y scales
Attachment 13 - per DSSSD LEC m_p versus m_n
- no conditions
Attachment 14 - per DSSSD LEC p strip versus n strip
- no conditions
Attachments 15-16 - per DSSSD LEC E_p versus E_n - x and y-axes 20keV/channel
- LEC energy difference +/- 2000 channels (+/- 11200keV)
Attachments 17-18 - per DSSSD p strip versus n strip
- HEC-LEC time difference <1s
- HEC-LEC time difference <100s
Attachment 19 - per DSSSD HEC m_p versus m_n
Attachment 20 - per DSSSD HEC p strip versus n strip
- no conditions
- z_hec=1 => implant stops in DSSSD#1
- z_hec=3 => implant hits DSSSD#1 and DSSSD#2 but does not necessarily stop in DSSSD#2
Attachment 21 - per DSSSD HEC E_p versus E_n - x and y axes 20MeV/channel
Attachment 22 - DSSSD#1 HEC E_p versus DSSSD#2 HEC E_p - x and y axes 20MeV/channel
- few events stop in DSSSD#2
- most events lower Z and A - fission fragments?
Attachment 23 - per DSSSD per pixel HEC-LEC time difference 4.096us/channel
- events observed to <<100us
Attachment 24 - per DSSSD per pixel HEC-LEC time difference (1s/channel) versus LEC energy (20keV/channel)
- alpha events long lived
- some evidence of effect of on spill deadtime in implant-decay correlations (cf. S100 and S505)
Attachment 25 - per DSSSD implant and decay event p strip - n strip time difference (2us/channel)
- wider distribution for implant events as expected due to number of ASIC active channels in implant events
- most decay events +/-2us - lower ASIC occupancy for decay events so most events will be from same (or adjacent) clock cycle |
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